| abstract |
A substrate having excellent adhesion to a resin and excellent heat resistance is provided. A substrate using two types of coupling agents having a specific structural formula (the ratio of coupling agent A and coupling agent B is a weight ratio, coupling agent B / coupling agent A = 0. 001 to 2.0), the adhesion between the substrate and the resin is improved. Moreover, the heat resistance of a base material improves by this process. [Selection figure] None |