| abstract |
When the surface of a bump electrode is flat, if the probe card is misaligned, the needle slips off the bump electrode, and the probe card needle hits other than the bump electrode, causing scratches on the pattern. Cause defects. Irregularities are formed on the bump electrode surface. For this purpose, a slit portion is provided in advance in the Al layer bonding pad portion, an HDP interlayer oxide film and a SiON film or SiN film are grown thereon, and a bump electrode is further formed thereon. At this time, unevenness is inherited by each layer in the upper part of the slit. By placing the probe card needle in the concave portion of the bump electrode surface, needle misalignment can be prevented. [Selection] Figure 8 |