| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9998899de8ae6a876452b1c2f31a13c2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B8-4455 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B8-4281
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B8-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B06B1-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B06B1-0644 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61B8-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04R31-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04R17-00 |
| filingDate |
2010-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42203f7de40762c920d690902436aa82
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_454befd4f9e8bc42553373228a22bca8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44a184ed892ffd9d07b36aa93932d95e |
| publicationDate |
2010-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2010158522-A |
| titleOfInvention |
Probe for ultrasonic diagnostic apparatus and manufacturing method thereof |
| abstract |
To provide an invention for a probe for an ultrasonic diagnostic apparatus and a method for manufacturing the same. A probe for an ultrasonic diagnostic apparatus according to a disclosed invention includes a sound absorbing layer including a first electrode part, a piezoelectric body connected to the first electrode part, and a second electrode part connected to the piezoelectric body. An acoustic matching layer, and a PCB connected to the first electrode portion and the second electrode portion. According to the present invention, since the connection work between the piezoelectric body and the PCB is performed quickly and easily, the manufacturing time is shortened, the manufacturing is easy, and the durability and uniformity of the connection portion are improved. It is possible to prevent performance degradation due to poor bonding with the PCB. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018100914-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012060634-A |
| priorityDate |
2009-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |