http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010157600-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b0f7012275f56834dbe07c6e3d0654dd
classificationIPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
filingDate 2008-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_735cad5d45f507a1d070087d391ec886
publicationDate 2010-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2010157600-A
titleOfInvention Wiring board manufacturing method
abstract PROBLEM TO BE SOLVED: To provide excellent adhesion strength between an insulating substrate made of an electrically insulating material containing polyphenylene ether resin and a wiring conductor embedded in the surface of the insulating substrate and an insulating resin layer such as a solder resist layer or a build-up resin layer To provide a wiring board. A step of preparing an insulating substrate 1 made of an electrically insulating material containing a polyphenylene ether resin and having a main surface embedded with a wiring conductor 2 made of copper foil, a main surface of the insulating substrate 1, and the main surface Blasting the exposed surface of the wiring conductor 2 embedded in the surface, etching the surface layer portion having a thickness of 2 to 4 μm from the exposed surface of the blasted wiring conductor 2, and removing the surface layer portion by etching. A step of roughening the exposed surface of the wiring conductor 2 with a roughening solution, and applying an insulating resin layer 3 partially covering the exposed surface of the main surface of the insulating substrate 1 and the wiring conductor 2 A process for manufacturing a wiring board. [Selection] Figure 9
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015142090-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011199270-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017050568-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012182437-A
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Total number of triples: 27.