http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010157590-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-387 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-421 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0055 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09581 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09509 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4661 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-422 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| filingDate | 2008-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5e5068e2ba0604d958da200bf818774c |
| publicationDate | 2010-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2010157590-A |
| titleOfInvention | Manufacturing method of multilayer wiring board |
| abstract | An object of the present invention is to provide a method for manufacturing a multilayer wiring board capable of manufacturing a multilayer wiring board having vias between vias and having fine wiring by a simple method. (A) a step of forming an insulating layer on the surface of the substrate having a portion capable of conducting electricity on the surface; and (B) forming a via hole by partially removing the insulating layer with a laser or a drill. And (C) performing a desmear process on the surface on which the via hole is formed in the step (B) to remove a residue of the insulating layer at the bottom of the via hole, and (D) the (C) A step of forming a resin layer using a resin having a functional group and a polymerizable group that form an interaction with the plating catalyst element on the surface subjected to the desmear treatment in the step; and (E) the step (D). And a step of removing the resin layer formed on the bottom of the via hole by applying a treatment liquid, and (F) applying a plating catalyst to the remaining resin layer and then performing plating. A method for manufacturing a substrate. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012060031-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012033152-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013018456-A1 |
| priorityDate | 2008-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 112.