http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010153790-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 |
filingDate | 2009-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_185a59569550cc953146c98b8101ca54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6b92f3f528c6267e11b09922f449df09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7ce24842ebac4f6c3a8c9579e95d917f |
publicationDate | 2010-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2010153790-A |
titleOfInvention | Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method using the same, and method for producing chemical mechanical polishing aqueous dispersion |
abstract | An object is to provide an aqueous dispersion for chemical mechanical polishing that simultaneously has a high polishing rate and high planarization characteristics for a wiring material, a barrier metal film, and an interlayer insulating film, and a chemical mechanical polishing method using the same. An aqueous dispersion for chemical mechanical polishing according to the present invention contains (A) silica particles, (B) maleic acid, and (C) a heterocyclic compound, and has a pH value of 8 or more. The ratio (W B / W C ) between the content of (B) maleic acid (W B : mass%) and the content of the (C) heterocyclic compound (W C : mass%) is less than 12. 1.5 to 100. [Selection figure] None |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017222860-A |
priorityDate | 2008-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 86.