http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010153410-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6572309f22e2ad56c1390a78ac237bed
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683
filingDate 2008-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d99da24b56f9f546b7837a1062fcdafc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2e444ca39c9841e8147e24805f6d6c34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ffa6ddfcb1f0ca30504610e8fea6cc10
publicationDate 2010-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2010153410-A
titleOfInvention Substrate holder and semiconductor wafer processing method
abstract The present invention provides a simple substrate holder and a semiconductor wafer processing method that secure a flat work area and contribute to safe processing and flat correction. A grip frame 10 for holding a self-adhesive layer 2 for a semiconductor wafer 1 and a processing support stage 20 fitted to the grip frame 10 are provided, facing the self-adhesion layer 2 of the processing support stage 20. The surface 21 is formed flat, and an endless fitting groove 22 into which the grip frame 10 is fitted is drilled in the peripheral portion of the surface 21. Since the flat surface 21 of the processing support stage 20 functions as a work area for the semiconductor wafer 1, even if the semiconductor wafer 1 is thinned to 100 μm or less and easily broken, the semiconductor wafer 1 can be processed safely. . Even when the semiconductor wafer 1 is warped in a bow, it can be corrected to a flat shape by using the flat surface 21. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020009873-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012059749-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013191756-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9406542-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I563551-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6374132-B1
priorityDate 2008-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002373929-A
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID83286
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID27982
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419613606
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419554239
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID447854088
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415776903
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID727
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419521138
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID21902473
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID9665

Total number of triples: 31.