http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010149193-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2a12bcbda96cc52c1240208b5640986d |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B28D5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B26F3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B26F3-08 |
filingDate | 2008-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42135b19f880068238fc99785e234b9c |
publicationDate | 2010-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2010149193-A |
titleOfInvention | Method for producing fragmented or thin plate-like material using stress of adhesive resin |
abstract | The present invention provides a method for dividing or slicing a substantially plate-like substance into an arbitrary size by using curing stress and / or thermal expansion / shrinkage stress of an adhesive without requiring a complicated process. The present invention provides a method for dividing or cutting a rough plate-like substance into an arbitrary size by applying a curing stress and / or thermal expansion / shrinkage stress of an adhesive to the substantially plate-like substance. . Further, the substantially plate-like substance is cured and bonded to a film whose elastic modulus is closer to that of the adhesive after curing than the substantially plate-like substance, and the film is stretched to stretch the film. Provided is a method for easily separating a substantially plate-like substance and an adhesive after curing by reducing the adhesive force. [Selection] Figure 1 |
priorityDate | 2007-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 260.