http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010141265-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c186e9ae8cafab5df5c8d80cfa7b0fa1 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate | 2008-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_73eec1752579209b2ec9bb5421091e0f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c961b4407dbabfdc610ac72f5155d59 |
| publicationDate | 2010-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2010141265-A |
| titleOfInvention | Printed wiring board connection structure and connection method |
| abstract | To provide a connection structure and a connection method between a first printed wiring board, an electronic component, and a second printed wiring board, which are manufactured at a low cost by simplifying the manufacturing process. A metal electrode 5 of a flexible printed wiring board 3 is connected to a wiring electrode 4 of a wiring board 1 by an electrode connecting adhesive 2. The wiring electrodes 4 and the metal electrodes 5 are provided with anti-oxidation films 4a and 5a, which are organic films for preventing oxidation, on the surfaces of the wiring electrodes 4 and the metal electrodes 5, respectively. The film thickness T of these antioxidant films 4a and 5a is formed to be 0.05 μm or more and 0.5 μm or less. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106604543-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106604543-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10412823-B2 |
| priorityDate | 2008-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 52.