| abstract |
In a semiconductor device on which a semiconductor chip having a protective film formed on the back surface is mounted, a chip protective film capable of manufacturing a highly reliable semiconductor device even when exposed to severe heat and humidity conditions To provide a forming sheet. An acrylic copolymer having a release sheet and a protective film forming layer formed on the release surface of the release sheet, the protective film forming layer having a structural unit derived from (meth) acryloylmorpholine. A protective film-forming sheet for chips, comprising a protective film-forming composition containing a polymer (A), an epoxy thermosetting resin (B), and a thermosetting agent (C). [Selection] Figure 1 |