Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4edd4e526605dbd18b513b4b30d19ab2 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-351 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-131 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0361 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05567 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03436 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-94 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05647 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02377 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11849 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05548 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01015 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02331 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1132 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02319 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02351 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0312 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
filingDate |
2008-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38a77d06c4b47fd1cc5e1450f0a6b828 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea69f6195b4dbb4b7f2202eb9b7e43b6 |
publicationDate |
2010-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2010129916-A |
titleOfInvention |
Element mounting substrate, element mounting substrate manufacturing method, semiconductor module, and portable device |
abstract |
In a semiconductor module having a structure in which a protruding electrode provided in a wiring layer is connected to an element electrode provided in a semiconductor element, connection reliability between the protruding electrode and the element electrode is improved. An insulating resin layer is provided between a semiconductor element and a wiring layer. The protruding electrode 60 that is formed integrally with the wiring layer 50 and protrudes from the wiring layer 50 toward the insulating resin layer 40 is electrically connected to an element electrode provided in the semiconductor element 20. The height of a part of the wiring layer 50 on the end side of the protrusion connection region 52 is lower than the height of the wiring layer 50 in the wiring region 54 extending to the side opposite to the end side. [Selection] Figure 1 |
priorityDate |
2008-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |