| abstract |
The present invention provides an inter-step wiring structure and an inter-step wiring method capable of stably forming an insulating slope provided to alleviate a step portion of an inter-step wiring by an ink jet method. A step portion is covered with first and second slopes 15 and 16 formed by droplets of insulating ink, and first or second metal wirings 18 and 16 are respectively formed on the upper surfaces of the slopes by droplets of conductive ink. 19 is laid. At this time, the surface on which the first and second slopes 15 and 16 are formed including the stepped portion is covered with the liquid repellent layer 14 that repels the dispersion medium of the insulating ink. In FIG. 5, a plurality of dots 20 </ b> D made of resin ink droplets are formed in the region where the slopes 15 and 16 are formed. Then, the slopes 15 and 16 are formed by the solid layer 21 </ b> D formed from the droplets arranged in such a manner as to connect the dot rows including the dots 20 </ b> D. [Selection] Figure 7 |