| abstract |
A printed layer containing semiconductor nanoparticles provided on a substrate is baked at a low temperature for a short time to produce a dense, smooth, excellent performance, and further thinned semiconductor substrate. Provide a well-manufacturing method. A method of manufacturing a semiconductor substrate in which a coating layer containing semiconductor nanoparticles is printed in a pattern on a substrate to form a printed layer, and then the printed layer is baked to form a patterned semiconductor layer. A method for producing a semiconductor substrate, the method comprising subjecting the printed layer to a surface wave plasma generated by application of microwave energy to calcinate the printed layer. [Selection figure] None |