| abstract |
A support plate is peeled off from a wafer to which a support plate is attached easily in a shorter time. In the peeling method according to the present invention, a first adhesive layer 4 and a second adhesive layer 5 that dissolves in a solvent faster than the first adhesive layer 4 or the first adhesive layer 4 are dissolved. The support plate 3 is peeled from the wafer 2 to which the support plate 3 is bonded via the second adhesive layer 5 that is dissolved in a solvent different from the solvent to be used. And the peeling method which concerns on this invention includes the peeling process which melt | dissolves the 2nd adhesive bond layer 5 located in the support plate 3 side, and peels the support plate 3 from the wafer 2. FIG. [Selection] Figure 1 |