http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010103154-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00 |
| filingDate | 2008-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1788c0243b752fc0b1db5b32240c9d4c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_216323f9523da86c9b3fd455e6e912f4 |
| publicationDate | 2010-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2010103154-A |
| titleOfInvention | Adhesive sheet for semiconductor and dicing integrated semiconductor adhesive sheet using the adhesive sheet for semiconductor |
| abstract | PROBLEM TO BE SOLVED: To provide an adhesive sheet for a semiconductor that can sufficiently bond in a short time, has excellent substrate unevenness in molding, and can be thinned, and a dicing integrated semiconductor adhesive sheet using the sheet. . SOLUTION: After thermocompression bonding to an adhesive sheet for a semiconductor or a silicon wafer having a storage elastic modulus of 6 MPa or more and less than 5 MPa at 170 ° C. after curing at 150 ° C. after dynamic curing, after curing at 150 ° C. for 2 minutes A semiconductor adhesive sheet having an adhesive layer having an adhesive strength of 0.1 MPa or more, and a dicing integrated semiconductor adhesive sheet obtained by laminating the semiconductor adhesive sheet and a dicing tape. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010135765-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2014003056-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101381119-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012099561-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018016673-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014003056-A1 |
| priorityDate | 2008-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 119.