| abstract |
Disclosed is a conductive paste that is excellent in low-temperature curability, plating properties, and printability and that can form a good circuit by plating, and an electrical wiring using the same. A conductive powder (A), a polyvinyl acetate resin (B), a polyester resin and / or a polyurethane resin (C), a blocked isocyanate (D) blocked with an active methylene compound, and an organic solvent (E). The glass transition temperature of the resin (C) is −50 ° C. or higher and 20 ° C. or lower, and the total amount of the resin (C) is 50 to 400 parts by weight with respect to 100 parts by weight of the resin (B). The electrically conductive paste whose total amount of resin (B), the said resin (C) component, and the said block isocyanate (D) is 10-60 weight part with respect to 100 weight part of said electrically-conductive powder (A). An electrical wiring in which this conductive paste is formed on an insulating substrate. [Selection] Figure 5 |