| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0047 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F218-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F216-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F238-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F218-12 |
| filingDate |
2008-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2ef6aa5331b99b43e8129d7fc892f0dd |
| publicationDate |
2010-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2010100785-A |
| titleOfInvention |
Photosensitive composition and method for producing processed substrate |
| abstract |
A photosensitive composition having low viscosity and excellent heat resistance and mechanical strength is provided. A polymerizable monomer (A) having at least one functional group X satisfying the following conditions is 0.01 to 98% by mass, having at least one functional group Y satisfying the following conditions, and having a functional group X: A photosensitive composition characterized by containing 0.01 to 98% by mass of a polymerizable monomer (B) not containing water and 0.01 to 15% by mass of a photopolymerization initiator. Functional group X: a functional group having a reaction rate of 50% or more when exposed under specific exposure conditions, and a reaction rate of 80% or more after heat treatment at 200 ° C. for 30 minutes after exposure. Functional group Y: a functional group having a reaction rate of less than 50% when exposed under specific exposure conditions, and a reaction rate of 80% or more when heat-treated at 200 ° C. for 30 minutes after exposure. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10338467-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103503115-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012216627-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180067718-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9631081-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102067353-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150004245-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013189547-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101592997-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013161627-A1 |
| priorityDate |
2008-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |