http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010098100-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cdd94f212dc7aef02fc1dcf28fa9b4fd |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 |
| filingDate | 2008-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc563b0628c9da1d593d33efca799819 |
| publicationDate | 2010-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2010098100-A |
| titleOfInvention | Printed wiring board and manufacturing method thereof |
| abstract | A method of manufacturing a printed wiring board with good productivity, miniaturization, and good adhesion between a printed wiring and a resin support is provided. In addition, a printed wiring board manufactured by the manufacturing method is provided. A printed wiring board manufactured using a resin support and a metal supply film, wherein the resin support is a resin support in which an alkoxysilane compound having a thiol group is bonded to the surface thereof. And the printed wiring board characterized by performing patterning exposure. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5624703-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015130312-A |
| priorityDate | 2008-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 66.