| abstract |
A resin composition suitable for forming an insulating layer of a multilayer printed wiring board or the like, wherein the insulating layer has a low coefficient of thermal expansion when an insulating layer obtained by thermosetting the resin composition is formed. The provision of a resin composition that can form a uniform roughened surface with a low roughness on the surface of the insulating layer and that is excellent in the adhesion of the conductor layer formed on the roughened surface. A resin composition comprising (A) an epoxy resin, (B) a cyanate ester resin, (C) an adduct of an imidazole compound and an epoxy resin, and (D) a metal-based curing catalyst. [Selection figure] None |