http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010087285-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5db580deca7130dbe51805c6c608b35 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-26 |
| filingDate | 2008-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b1d3d1b364a01ae7be164af54b7fb68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f2d2d88576d15adc19578a4e976b17b4 |
| publicationDate | 2010-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2010087285-A |
| titleOfInvention | Multilayer circuit board manufacturing method |
| abstract | A high-density conductive film pattern is formed on an insulating resin film by removing smear, which is a resin residue generated on the bottom surface of the opening, when forming a via hole opening by laser irradiation of the insulating resin film in the manufacture of a multilayer circuit board. Implement as possible. A dummy film pattern for reducing adhesion to a resin film is formed at a predetermined position on a conductive film (pattern) on an insulating substrate, an insulating resin film is further formed thereon, and a protective film is further formed thereon. Laminate and irradiate laser at the predetermined position to form a via hole opening in the insulating resin film. By doing this, it is possible to remove smear by short-time plasma treatment, avoiding roughening of the surface of the insulating resin, and as a result, high-density and high-aspect-ratio conductive circuit patterns (electro-copper plating patterns) can be easily obtained. This can be applied and enables the production of a multilayer circuit board having a high-density conductive circuit pattern by a build-up method. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101583543-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012111375-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102833952-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140009312-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102833952-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8898895-B2 |
| priorityDate | 2008-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 47.