http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010087085-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_44b2ac87aeadb161b83426d9cf6c4bdc |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92244 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73267 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-24226 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 2008-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d2b451bad7535f53a73921f52cfad54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d23350336126e89a12c6a3d42399c96 |
| publicationDate | 2010-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2010087085-A |
| titleOfInvention | Electronic component built-in substrate and manufacturing method thereof |
| abstract | An electronic component capable of preventing deformation of an insulating layer and a substrate due to a stress of a vaporizing component that may occur during manufacturing or operation, and capable of realizing stable operation even when the electronic component has a high operating frequency. Provided are an embedded substrate and a method for manufacturing the same. A semiconductor-embedded substrate 1 that is an electronic component-embedded substrate has resin layers 20 and 21 laminated on a conductor layer 12a provided on a support base 11 of a double-sided CCL 10, and the conductor layer 12a inside the resin layer 20a is laminated. The carbon nanotube sheet S and the semiconductor device 30 are built in this order at opposing positions. A through hole T2 is formed in the resin layer 21, and an end portion St of the carbon nanotube sheet S is exposed inside the resin layer 21. The through hole T2 is filled with a resin layer 22 having a density lower than that of the resin layers 20 and 21, and the end portion St of the carbon nanotube sheet S and the resin layer 22 are in contact with each other. [Selection] Figure 3 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9793241-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10134693-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017224787-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101776298-B1 |
| priorityDate | 2008-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 34.