http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010084195-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-00
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filingDate 2008-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bf0839345ce1f30e8fb7f6343cc760cc
publicationDate 2010-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2010084195-A
titleOfInvention Copper plating system, copper plating method, and electrolytic plating solution manufacturing method
abstract Electrolytic plating with high accuracy is possible, and copper ions are recovered from an electrolytic plating solution after electrolytic plating and reused to reduce production costs. A copper sulfate aqueous solution manufacturing apparatus, an additive supply apparatus, an electrolytic plating apparatus, and a copper ion recovery apparatus for recovering copper ions from an electrolytic plating solution discharged from the electrolytic plating apparatus are provided. The copper ion recovery apparatus 10 includes an ion generation tank 11, a first diaphragm 14 that partitions the ion generation tank 11 into an anode chamber 12 and an intermediate chamber 13 and is permeable to hydrogen ions and copper ions, and an ion generation tank 11. And a second diaphragm 16 capable of permeating hydrogen ions, an anode 18a provided at least in the anode chamber 12, and a cathode 17 provided in the cathode chamber 15. The path 13a is configured to deliver copper ions to at least one of the copper sulfate aqueous solution manufacturing apparatus 20, the additive supply apparatus 30, and the electrolytic plating apparatus 40. [Selection] Figure 2
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Total number of triples: 32.