http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010080702-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
filingDate 2008-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fe39d787cdbfe5e96e0ac3efc3523a11
publicationDate 2010-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2010080702-A
titleOfInvention Multilayer printed wiring board
abstract In a multilayer printed wiring board having an electrolytic copper foil which is a smooth shiny surface on one side and a matte surface on the other side, and an IVH having the mat surface as a bottom, the mat surface is a bottom. When an IVH (interstitial via hole) is formed on a multilayer printed wiring board by laser processing, a laser processing residual due to a non-organic film decomposition product on the copper foil on the mat surface is generated on the plating surface. Cheap. Therefore, a connection failure is likely to occur between the bottom surface of the IVH and the mat surface in contact therewith. The present invention easily removes laser processing residuals and dirt in the IVH with the copper mat surface as the bottom, and improves the connection failure that occurs between the bottom surface of the IVH and the mat surface in contact therewith. Before forming an IVH with the mat surface as a bottom, the electrolytic copper foil at the bottom is half-etched so as to reduce the average surface roughness to 3 μm or less. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015173302-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11160174-B2
priorityDate 2008-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 28.