| abstract |
Disclosed is an epoxy resin composition that has excellent moldability, has high thermal conductivity when combined with an inorganic filler, and has a low thermal expansion property and excellent heat resistance and moisture resistance. A cured molded product using the same is provided. In an epoxy resin composition mainly composed of an epoxy resin and a curing agent, or these and an inorganic filler, as a curing agent component, a powdery 4,4′-dihydroxybiphenyl having an average particle system of 10 μm or less. An epoxy resin composition containing 30 wt% or more. [Selection figure] None |