http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010062168-A

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filingDate 2008-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e53fd8980f66ae90bf15b9e82a51f59e
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publicationDate 2010-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2010062168-A
titleOfInvention High-frequency semiconductor element, epitaxial substrate for forming high-frequency semiconductor element, and method for producing epitaxial substrate for forming high-frequency semiconductor element
abstract An epitaxial substrate capable of realizing a semiconductor element for high-frequency operation having cost merit and excellent characteristics is provided. An insulating layer made of SiC having a specific resistance of 1 × 10 6 Ωcm or more is formed on a base material made of SiC having conductivity by doping vanadium to form a base substrate. obtain. On the lower fabric substrate, a buffer layer made of AlN, a channel layer made of GaN, and Al x In y Ga z N ( x + y + z = 1) consisting of a barrier layer is epitaxially formed. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019117908-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200033982-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014196466-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022041157-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9882042-B2
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023008031-A1
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Total number of triples: 38.