| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d5d04736b0b882a4f5a1e0e0e4cd8cbb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4e637de5f54efec56ab27b22cd04f8cb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1889
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-30 |
| filingDate |
2008-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3def89aa3ed1baf69f2c63ed6689f583
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1dff8ccb10b44aa7691363004e0b7f5a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f8153f5e6b20b27abd8db32592b5e93e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fae79bbe0a75953b8e74b7b4f69bb6dd |
| publicationDate |
2010-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2010053435-A |
| titleOfInvention |
Sensitizing solution for electroless plating and electroless plating method |
| abstract |
Disclosed is an electroless plating sensitizing solution which can easily dissolve Sn compounds without using an acid and can be used for a long time without impairing the uniformity of a metal plating film. A sensitizing solution for electroless plating containing an Sn compound and a solvent, wherein the solvent contains 10% by volume or more of a water-soluble alcohol. Further, the present invention includes a pretreatment step of immersing the object to be plated in a pretreatment liquid and a plating step of immersing the object to be plated in the plating solution after the pretreatment process. An electroless plating method using a sensitizing solution for electroplating. [Selection] Figure 2 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9093192-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2607520-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014141712-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101539913-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5497183-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2607520-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017212245-A |
| priorityDate |
2008-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |