| abstract |
Provided is a pattern curable resist material and a pattern forming method including a step of curing a resist film, thereby enabling highly fine processing by a double patterning process or the like. A polymer compound containing a monomer having a naphthalene ring represented by general formula (1) and a repeating unit derived from the monomer. (R 1 is H, F, a divalent organic group .R 3, organic group R 4 is H, or C1-10 monovalent methyl or trifluoromethyl .R 2 is C1-10 .R 2 And R 3 or R 2 and R 4 may be bonded together to form a ring together with the carbon atom to which they are bonded, and R 3 and R 4 may be bonded together to form a ring with the carbon atom to which they are bonded. X is a hydroxyl group, a halogen atom, or a monovalent organic group of C1 to 10. n is 0 to 7.) [Selection figure] None |