http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010050397-A

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-40
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filingDate 2008-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d39f0570bacabd20cb14e05e6f211a79
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publicationDate 2010-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2010050397-A
titleOfInvention Method for manufacturing printed wiring board
abstract The present invention provides a method for producing a printed wiring board that is easy to dispose of waste liquid and has a sufficient smear removing effect. In a method of manufacturing a printed wiring board, a laser beam is irradiated to a multilayer laminate in which a resin layer (1a, 2) and a copper layer (1b, 3) are laminated to form a via (BV). A swelling treatment step of immersing the multilayer laminate after irradiation with light in a non-oxidizing swelling agent, a microetching treatment step in which a microetching agent is brought into contact with the multilayer laminate after the swelling treatment step, and the microetching An ultrasonic treatment step of applying ultrasonic waves in a state where the multilayer laminated board after the treatment step is immersed in a liquid. [Selection] Figure 2
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priorityDate 2008-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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