http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010050321-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate | 2008-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_05eb84bab20c8e8a2efd8f85f18abda2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5625cb555ca9c1142441c4c237bd7267 |
| publicationDate | 2010-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2010050321-A |
| titleOfInvention | Method of bonding adhesive sheet for protecting semiconductor wafer |
| abstract | A method for laminating a pressure-sensitive adhesive sheet for protecting a semiconductor wafer, wherein the semiconductor wafer is curved (warped) even when the semiconductor wafer is ground to an extremely thin thickness or when a large-diameter wafer is ground. Provided is a method for laminating a pressure-sensitive adhesive sheet for protecting a semiconductor wafer, which can be operated without causing it. In a method of bonding a protective pressure-sensitive adhesive sheet including a base material and a pressure-sensitive adhesive layer to the surface of a semiconductor wafer, the initial elastic modulus in the base material winding direction at the time of manufacturing the base material is greater than the base material winding direction. Protective pressure-sensitive adhesive using a base material having a tensile strength after 10 minutes of 2% elongation in the base material sticking direction, which is greater than the initial elastic modulus in the base material width direction, which is a direction perpendicular to the vertical direction, of 1.5 N / 15 mm or less A method for laminating an adhesive sheet for protecting a semiconductor wafer, comprising laminating sheets. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017057341-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2013065417-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021059602-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013065417-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011216735-A |
| priorityDate | 2008-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 105.