http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010050271-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9d5ebd9bdc11f7a4b267d7e865d5a84f |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 |
| filingDate | 2008-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_89bb62e7c6a964fa2572ec58013c74d7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7a617fb4f935bc6ee3355b6390ac5cd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f2b7e810d73fce40f2a9fe9f5a40fb7e |
| publicationDate | 2010-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2010050271-A |
| titleOfInvention | Circuit board |
| abstract | A pad portion formed of metal fine particles is stably maintained in an adhesive state on a substrate. A circuit pattern 3 including a wiring part 3b formed on a substrate 2 made of an insulating material by printing and including a pad part 3a connected to the wiring part 3b and having a larger area than the wiring part 3b is provided. Provided is a circuit board 1 provided with a cover coat layer made of an adhesive material formed by printing on the entire circumference of the periphery of the circuit pattern so as to be in contact with 3a and the wiring part 3b and to be thinner than the pad part 3a To do. [Selection] Figure 1 |
| priorityDate | 2008-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 36.