| abstract |
An object of the present invention is to provide an adhesive that can improve the connection reliability between electrodes and has excellent storage stability when electrodes are connected via an adhesive at a low temperature. An adhesive 2 has a film shape, an epoxy resin curing agent, a first adhesive 7 containing at least one of an epoxy resin having an epoxy equivalent of 1000 or more and a resin not containing an epoxy group, An epoxy resin having a film shape and separated from the first adhesive and having a pot life of 10 days or less with the epoxy resin curing agent, and a second adhesive 8 containing conductive particles are provided. Yes. [Selection] Figure 2 |