| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
2008-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd1011a500dbb41e83d3d2abce4b4de2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8703c92dfc869a9ad38d32bdcccd9acf |
| publicationDate |
2010-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2010037352-A |
| titleOfInvention |
Underfill agent composition |
| abstract |
An underfill agent suitable for a semiconductor device having a copper bump is provided. An underfill composition comprising the following components (A) to (D): (A) epoxy resin 100 parts by mass (B) an amine curing agent or an acid anhydride curing agent, 0.7-1.2 equivalent (C) inorganic filler with respect to equivalent, 50-500 mass parts (D) imidazole silane coupling agent with respect to 100 mass parts in total of (A) component and (B) component 0.01 to 10 parts by mass with respect to 100 parts by mass in total of the component (A) and the component (B). [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011122161-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011225798-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015175856-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9748158-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020186397-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105838030-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018188580-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9805998-B2 |
| priorityDate |
2008-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |