| abstract |
To provide a nickel plating bath which is excellent in uniform electrodeposition and low in plating cost. The nickel plating bath of the present invention contains 4 g / L to 100 g / L of nickel chloride hexahydrate, 50 g / L to 300 g / L of sodium citrate dihydrate, boric acid, etc. The pH buffer is not included or is not more than the saturation concentration, nickel sulfate hexahydrate is not included or is 30 g / L or less, and the pH is 6.5 to 10 It is characterized by. [Selection figure] None |