http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010030030-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-08 |
filingDate | 2008-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0f78871aafcf296737b1367fe61d12cd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f9d2a0aec2f8cbf1398ec6d34095a58d |
publicationDate | 2010-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2010030030-A |
titleOfInvention | Surface polishing method for thin film brittle materials |
abstract | An object of the present invention is to provide a polishing method capable of efficient and stable polishing without warping or breakage due to cracking. In a method of double-side polishing a thin film brittle material having a thickness of 500 μm or less and a fracture toughness of 10 MPa · √m or less, the total polishing amount of each polished surface is set to 100 μm or less and one surface is fixed. Then, the other surface is polished, and the polishing amount of the one surface 2a: the polishing amount of the other surface 2b is in the range of 20: 1 to 1:20 as a ratio of the polishing amount of the polishing surface at each time. A method for polishing a surface of a thin film brittle material. [Selection] Figure 1 |
priorityDate | 2008-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 24.