http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010030030-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-08
filingDate 2008-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0f78871aafcf296737b1367fe61d12cd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f9d2a0aec2f8cbf1398ec6d34095a58d
publicationDate 2010-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2010030030-A
titleOfInvention Surface polishing method for thin film brittle materials
abstract An object of the present invention is to provide a polishing method capable of efficient and stable polishing without warping or breakage due to cracking. In a method of double-side polishing a thin film brittle material having a thickness of 500 μm or less and a fracture toughness of 10 MPa · √m or less, the total polishing amount of each polished surface is set to 100 μm or less and one surface is fixed. Then, the other surface is polished, and the polishing amount of the one surface 2a: the polishing amount of the other surface 2b is in the range of 20: 1 to 1:20 as a ratio of the polishing amount of the polishing surface at each time. A method for polishing a surface of a thin film brittle material. [Selection] Figure 1
priorityDate 2008-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 24.