| abstract |
PROBLEM TO BE SOLVED: To harden a sealing film made of a liquid resin in manufacturing a semiconductor device in which a top surface, a side surface and a lower surface of a silicon substrate are covered with a sealing film made of an organic resin, a side protective film and a lower protective film. Make the wafer difficult to warp. After a sealing film 15 made of an organic resin such as an epoxy resin is formed on the entire surface of a semiconductor wafer 21 by coating and curing, the sealing film 15 and the semiconductor wafer on the dicing street 22 and the regions on both sides thereof are formed. A second groove 27 for forming a side protection film is formed on the upper surface side of 21. That is, the sealing film 15 is formed by coating and curing in a state where a groove causing a decrease in strength is not formed on the upper surface side of the semiconductor wafer 21, and then a second groove 27 is formed on the upper surface side of the semiconductor wafer 21. Therefore, when the sealing film 15 made of a liquid resin is cured, the semiconductor wafer 21 can be prevented from warping. [Selection] Figure 7 |