http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010024459-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5357 |
| filingDate | 2009-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a700077587de1748973d7aef73e221c5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_528e56979bc78a351fbd064ee7604ca7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5f0c3d3e3559d87cffebb0dec057bbae http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22bb35ccf283eba5558025ab1599e2f3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a59541f1f0bd96b6ae9b730e11a61e73 |
| publicationDate | 2010-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2010024459-A |
| titleOfInvention | Flame retardant thermosetting resin composition, prepreg using the same, and laminate for electric wiring board |
| abstract | Provided is a material that achieves flame retardancy UL94V-0 when the content of halogen and antimony compounds is 0.1% by weight or less. SOLUTION: (A) an epoxy resin, (B) a thermosetting resin mainly composed of a compound having a dihydrobenzoxazine ring, and (C) a polycondensate of a compound having a phenol and a triazine ring and an aldehyde. (A) 5-80 parts by weight of an epoxy resin, (B) 5-80 parts by weight of a thermosetting resin having a dihydrobenzoxazine ring, based on 100 parts by weight of the total amount of (A), (B) and (C), C) 5 to 80 parts by weight of a polycondensate of a compound having a phenol and a triazine ring and an aldehyde, and (D) a reactive phosphorus compound represented by the general formula (1) or (2) A thermosetting resin composition containing 50 parts by weight and containing 0.1% by weight or less of halogen atoms and antimony compounds based on the total amount of materials used. [Selection figure] None |
| priorityDate | 2009-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 69.