| abstract |
Disclosed is an adhesive assembly having excellent film-forming properties and thermal fluidity, and having reliability of a semiconductor device such as peel strength, and a film-like adhesive, an adhesive sheet and a semiconductor device using the same. . An adhesive composition containing a polyvinyl acetal resin and a thermosetting resin, wherein the flow rate at 180 ° C. in the B stage of the adhesive composition is (A), and the flow at 180 ° C. in the C stage. When the amount is (B), the value of (A)-(B) is 100 μm or more, the flow amount at 180 ° C. at the B stage is 500 μm or more, and the flow amount at 180 ° C. at the C stage is An adhesive composition that is less than 500 μm. [Selection figure] None |