| abstract |
PROBLEM TO BE SOLVED: To provide a chip size packaging device device which realizes a reduction in size, thickness and weight at a low cost by using a glass substrate with a through electrode, and further high reliability. In an image sensor according to the present invention, a CCD-type or CMOS-type light receiving portion 12b is formed on a first main surface of a semiconductor substrate 12, and wiring for signal extraction is provided on the same surface. A pad for connection to an external circuit is provided on the periphery of the first main surface of the semiconductor substrate 12. A glass substrate 11 with a through electrode is disposed so as to cover the first main surface, and the through electrode 11b is electrically connected to the aforementioned pad. Here, a sealing material 14 is disposed around the opposing surfaces of the semiconductor substrate 12 and the glass substrate 11 with a through electrode, and the light receiving portion is simultaneously bonded to the semiconductor substrate 12 and the glass substrate 11 with the through electrode mechanically. A packaging device device is formed by protecting 12b from the external environment. [Selection] Figure 1 |