| abstract |
Provided is a probe card that employs a relay substrate system, is inexpensive and easy to align, and suppresses deterioration of contact between a probe and an electrode pad. A relay substrate 1 has a first surface 1a and a second surface 1b, and is formed on a substrate 301 having wirings 402 and 902 formed therein, and the first surface 1a. Package substrate 300 including pads 303 and 903 and pads 904 and 905 disposed on second surface 1b, insulating resin layer 305 bonded to first surface 1a, and pads of insulating resin layer 305 303 and 903, a via 306 formed in the through-hole 308, and a pad 307 covering the through-hole 308. The pad 303 is a pad via the wiring 402. The pad 307 is electrically connected to the pad 303 through the via 306. [Selection] Figure 1 |