Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y10-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B3-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B29-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D13-12 |
filingDate |
2009-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f75790d8971a4f9786386271f0c84ec |
publicationDate |
2010-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2010017848-A |
titleOfInvention |
Polishing pad manufacturing method and polishing pad |
abstract |
The present invention provides a pad useful for in situ end point detection using an optical method and useful for polishing an integrated circuit mounted wafer. A hard uniform resin that is useful for polishing integrated circuit mounted wafers, has no essential ability to absorb and transport slurry particles, and transmits light having a wavelength in the range of 190 to 3500 nm. A pad having a first portion made of a sheet and a second portion made of an air-injected synthetic urethane structure. [Selection figure] None |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9133299-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101277296-B1 |
priorityDate |
1995-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |