http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010017848-A

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filingDate 2009-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f75790d8971a4f9786386271f0c84ec
publicationDate 2010-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2010017848-A
titleOfInvention Polishing pad manufacturing method and polishing pad
abstract The present invention provides a pad useful for in situ end point detection using an optical method and useful for polishing an integrated circuit mounted wafer. A hard uniform resin that is useful for polishing integrated circuit mounted wafers, has no essential ability to absorb and transport slurry particles, and transmits light having a wavelength in the range of 190 to 3500 nm. A pad having a first portion made of a sheet and a second portion made of an air-injected synthetic urethane structure. [Selection figure] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9133299-B2
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Total number of triples: 25.