http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010010374-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0950e9df7f0e1b73efee1bda859951ad |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate | 2008-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97e6ee97d351143f665fd2cb2ce41f37 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a89c16e52c7e7a02598db066c2ea2dc1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_405b5ab53ae978058a34203b01231f2b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ef9b2199e66e4bc2415c714b07f862a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0378b0397cd74ee5cf0533fe3586403d |
| publicationDate | 2010-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2010010374-A |
| titleOfInvention | Manufacturing method of semiconductor package |
| abstract | Provided is a manufacturing method capable of suppressing burrs generated in a lead frame and stabilizing the shape of a semiconductor package. A first mold 2 and a second mold 3 are arranged so that a semiconductor element 100 mounted on a lead frame 101 is disposed in a first cavity 1a of a mold 1 having an open top. A step of sandwiching the lead frame 101 by the step, a step of filling the first cavity 1a with an uncured sealing resin composition that is liquid at room temperature, and an excess sealing resin composition for molding using a squeegee A step of flattening the surface of the sealing resin composition in the first cavity 1a by flowing into and removing the second cavity 1b provided on the upper surface of the mold 1, and curing the sealing resin composition A step of forming a sealing body for sealing the semiconductor element 100, a step of releasing the holding of the lead frame by the first mold 2 and the second mold 3, and an extrusion of the sealing body from the molding die 1. And releasing the mold. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104377173-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115249749-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015037146-A |
| priorityDate | 2008-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.