| abstract |
Aspects of the present invention generally provide an apparatus and method for processing a substrate using a plurality of chamber processing systems adapted to process the substrate and analyze the results of processes performed on the substrate. . In one aspect of the invention, one or more analysis steps and / or pre-cleaning steps are used to reduce the effect of cue time on device yield. In one aspect of the present invention, a system controller and one or more analysis chambers are used to monitor and control process chamber recipes and / or process sequences to form device defects and device performance change issues. Reduces substrate disposal due to Embodiments of the present invention also generally provide a method and system for repeatedly and reliably forming semiconductor devices used in various applications. [Selection] FIG. |