| abstract |
In some embodiments, the bottom surface of the via or the surface of the solder pad is caused by a laser output comprising at least one laser pulse (32) having a wavelength shorter than 400 microns and a pulse width shorter than 1,000 picoseconds. Reduce the number of pulses (δN) used for cleaning and improve process throughput. The laser output may be generated using an oscillator module (12) that cooperates with the amplification module (16). [Selection] Figure 2 |