| abstract |
A method and apparatus for processing a workpiece using a laser beam (89) includes first and second stages (74, 76) and first and second laser beam paths for holding the workpiece (78, 80). Including. The first workpiece is loaded onto the first stage that is aligned with the first laser beam path and processing is started. A second workpiece is prepared for the second laser beam path while the first workpiece is aligned with respect to the first laser beam path. Processing of the second workpiece begins as soon as the laser beam is available for processing. [Selection] Figure 5 |