http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009532918-A

Outgoing Links

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filingDate 2007-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2009-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2009532918-A
titleOfInvention Manufacturing method and structure of solar cell using layer transfer process
abstract Reusable silicon substrate device for using layer transfer process. The device has a surface area, a cleave area and a material thickness. The total thickness of the material is at least N times greater than the first thickness of material to be removed. In a specific embodiment, the first thickness of material removed is between the surface region and the cleave region, where N is an integer greater than about 10. The device also includes a chuck portion adapted to hold the handle substrate member in place. The chuck portion is configured to hold the handle substrate in such a way as to easily adhere the handle substrate to the first thickness of material to be removed. In a preferred embodiment, the device has a mechanical pressure element operably coupled to the chuck portion. The mechanical pressure element is adapted to apply a force to adhere the handle substrate to the first thickness of material to be removed. [Selection] Figure 23
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priorityDate 2006-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 34.