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publicationDate 2009-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2009532205-A
titleOfInvention Method for forming a pattern on a copper surface
abstract PROBLEM TO BE SOLVED: To describe a method of printing an ink or an organic resist at a high resolution on a copper or copper alloy surface using a droplet discharge printing mechanism. First of all, preferably the surface is micro-etched and, prior to printing, the surface of the copper surface can be reduced or brought into contact with an organic substance that can make the copper surface more hydrophobic. Resolution is achieved. The method is useful for the manufacture of electronic circuits. [Selection] Figure 2
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