| abstract |
A semiconductor chip on which solder bumps are formed and a manufacturing method thereof are provided. A semiconductor chip on which solder bumps are formed includes one or more metal adhesive layers (220, 230) formed on an electrode pad (110) of the semiconductor chip (100) and an interlayer formed on the metal adhesive layers (220, 230). The separation film 240 includes one or more permeation layers 250 formed on the interlayer separation film 240 and penetrating the solder bumps, and a solder bump 300 formed on the permeation layer. When the material of the permeation layer 250 flows into the solder bump 300, the solder bump 300 can be changed to a multi-component system, and the growth of IMC can be suppressed to increase the reliability. [Selection] Figure 2 |