| abstract |
The semiconductor structure (100, 900) includes a substrate (110) having one surface (111) and further includes one or more semiconductor chips (120) disposed on the substrate surface. The semiconductor structure further includes an electrically insulating structure (340) disposed over the substrate surface, the electrically insulating structure being integrally formed with the one or more electrical leads (341, 342) and these electrical leads. An organic element (343). The semiconductor structure further includes a solder element (350) that integrally connects the electrically insulating structure and the substrate surface. |