| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2383-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01077
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1815
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01063
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-20 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J3-243
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-54 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-54 |
| filingDate |
2006-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2009-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2009513021-A |
| titleOfInvention |
Method of manufacturing light emitting device having molded encapsulant |
| abstract |
Here, a method of manufacturing a light emitting device comprising an LED and a molded silicon-containing encapsulant is disclosed. The method includes contacting the LED with a photopolymerizable composition comprising a silicon-containing resin containing silicon-bonded hydrogen and an aliphatic unsaturation and a metal-containing catalyst that can be activated by actinic radiation. Thereafter, photopolymerization of the photopolymerizable composition is performed to form an encapsulant. At some point before the polymerization is complete, the mold is used to give the encapsulant a predetermined shape. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015005221-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018157180-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011012264-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2015005221-A1 |
| priorityDate |
2005-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |