| Predicate |
Object |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-627
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00 |
| filingDate |
2006-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2009-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2009509045-A |
| titleOfInvention |
Method of coating the surface of a substrate with metal by electroplating |
| abstract |
A method for coating a surface of a substrate with a metal by electroplating is provided. A method of coating a surface of a substrate with copper by an electroplating method, wherein the surface to be coated is brought into contact with an electroplating bath without applying an electrical bias to the surface to be coated; Forming a coating during biasing; separating the surface from the electroplating bath while electrically biasing the surface, the electroplating bath in a solvent A method characterized in that the solution comprises a copper ion source at a concentration of 0.4 to 40 mM; and at least one copper complexing agent. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014519201-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102014891-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014201835-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I594387-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140053912-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013536314-A |
| priorityDate |
2005-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |